JPH0129828Y2 - - Google Patents

Info

Publication number
JPH0129828Y2
JPH0129828Y2 JP1982093177U JP9317782U JPH0129828Y2 JP H0129828 Y2 JPH0129828 Y2 JP H0129828Y2 JP 1982093177 U JP1982093177 U JP 1982093177U JP 9317782 U JP9317782 U JP 9317782U JP H0129828 Y2 JPH0129828 Y2 JP H0129828Y2
Authority
JP
Japan
Prior art keywords
case
electronic device
circuit unit
electronic
filled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982093177U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58195481U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9317782U priority Critical patent/JPS58195481U/ja
Publication of JPS58195481U publication Critical patent/JPS58195481U/ja
Application granted granted Critical
Publication of JPH0129828Y2 publication Critical patent/JPH0129828Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Casings For Electric Apparatus (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)
JP9317782U 1982-06-21 1982-06-21 電子装置 Granted JPS58195481U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9317782U JPS58195481U (ja) 1982-06-21 1982-06-21 電子装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9317782U JPS58195481U (ja) 1982-06-21 1982-06-21 電子装置

Publications (2)

Publication Number Publication Date
JPS58195481U JPS58195481U (ja) 1983-12-26
JPH0129828Y2 true JPH0129828Y2 (en]) 1989-09-11

Family

ID=30223845

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9317782U Granted JPS58195481U (ja) 1982-06-21 1982-06-21 電子装置

Country Status (1)

Country Link
JP (1) JPS58195481U (en])

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002184908A (ja) * 2000-12-19 2002-06-28 Sony Corp 電子回路装置

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS519622U (en]) * 1974-07-05 1976-01-24
JPS519628U (en]) * 1974-07-08 1976-01-24

Also Published As

Publication number Publication date
JPS58195481U (ja) 1983-12-26

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